BIO |
Daniel F. Smith is an international trade and intellectual property attorney focusing his practice on Section 337 intellectual property investigations before the U.S. International Trade Commission and intellectual property litigation in U.S. district courts and appeals before the Federal Circuit. He counsels clients on patent infringement, invalidity and other intellectual property issues involving patents, trademarks and trade dress, and copyrights.
Dan represents clients on issues specific to the International Trade Commission, as well as on patent-related issues in Section 337 investigations and U.S. district court litigation. His litigation experience covers a broad range of technologies, including consumer electronics and accessories, mobile electronic devices and chipsets, semiconductors, and various mechanical devices. He has successfully obtained broad relief for complainants and successfully defended respondents in complex, multi-party investigations. Dan's experience encompasses all phases of litigation including discovery, motions practice, deposing and defending key corporate, fact, and expert witnesses, trial activity, and pre- and post-trial activity. He also assists clients with pre-filing due diligence and post-investigation enforcement efforts.
Prior to joining the firm, Dan was an associate with a large firm where he focused on patent litigation. Dan also worked as an electrical engineer for a global engineering-construction organization providing design, manufacturing, and procurement management for the fabrication, testing, delivery, installation, and field support of electronic components used in U.S. Navy submarines and aircraft carriers.
Dan is a contributing author to the second and third editions of the American Bar Association book entitled "A Lawyer’s Guide to Section 337 Investigations Before the U.S. International Trade Commission."
While in law school, Dan studied international business and trade while at the Jagiellonian University in Poland and competed in the Willem C. Vis International Commercial Arbitration Moot held in Vienna, Austria. He also researched case law and wrote legal memoranda on various federal statutes as an intern with the U.S. Attorney’s Office in Washington, D.C.
The Catholic University of America, Columbus School of Law, J.D., magna cum laude
Grove City College, B.S., Electrical Engineering, cum laude
Pennsylvania
District of Columbia
U.S. Court of Appeals for the Federal Circuit
U.S. Court of Federal Claims
Institute of Electrical and Electronics Engineers (Intellectual Property Committee)
ITC Trial Lawyers Association
Pennsylvania Bar Association